シラバス参照

科目名 機械工学特殊講義2 
科目名(英字) Advanced Lecture in Mechanical Engineering Ⅱ 
担当者氏名

ABRAHA PETROS

池本 有助

大島 成通

來海 博央

清水 憲一

中西 淳

成田 浩久

古川 裕之

松田 淳

吉川 泰晴

久保 貴

松原 剛

対象研究科・専攻 理工学研究科機械工学専攻-博士後期課程 
講義学期 後期 
単位数



準備学習・事後学習
Implement the study cycle: previewing, attending class, reviewing, studying, and checking your understanding for each module in full before you start the next one. It has to be noted that active participation is vital in attending classes.
毎回、講義時間の2倍の自学実習が求められます。 
授業の概要と目的
Nanotechnology represents technological development that concerns the management of material at the nanometer scale. The objective of this class is to have good insight in to the fabrication and application of chemical, physical, and biological systems at scales ranging from individual molecules or atoms to submicron dimensions, and also the integration of these resulting nanomaterials into larger systems. 
該当するCP(カリキュラム・ポリシー)およびDP(ディプロマ・ポリシー)
本授業はCP1.2.3.4およびDP1.2.3に該当する。 
科目ナンバリングコード
到達目標
Nanotechnology has emerged as a multidisciplinary field, and this class aims at the fundamental understanding of the electrical, optical, magnetic, and mechanical properties of nanostructures that deliver the next generation of functional materials with wide-ranging applications. 
授業内容
番号 【項目欄】 【内容欄】
1. Introduction to Nano-technology  Nanotechnology is the understanding and control of matter at the nanoscale, at dimensions between approximately 1 and 100 nanometers, where unique phenomena enable novel applications. 
2. Module 1: Nano-forming Machining of metal mirrors  The required machining opeation and attained form accuracy for plane and spherical surface machining is explained. 
3. Damage-free surface finishing  Fundamentals of polishing with emphsis on mechanochemical polishing of semiconductor silicon wafers are oulined. 
4. Module 2: Nano-manufacturing processes IC production process  IC total production system: Circuit design, pattern layout, mask drawing, waer process wafer testing, assembly and packaging are explained. 
5. Pattern inspection  Enphasis on accuracy and repeatability: Check on masks and fabricated wafer is indespensable for duplication of the pattern. 
6. Atomic layer epitaxy  Atomic layer epitaxy is a specialized form of thin film growth that typically deposit alternating monolayers of two elements onto a substrate. Characterization of the crystal lattice structure will be noted. 
7. Self-assembly processes  Several major self-assembly techniques driven by inertial, electrical, magnetic, and interfacial energy minimization will be discussed. 
8. Module 3: Nano-positioning systems Guide systems for moving elements  Comparison between eastic hinges, linear slide guides, and hydraulic slide guides will be made. 
9. Servo-control systems  Comparison between mechanical servo-actuator positioning sysems, Pneumatic servo-actuator systems electrostatic servo-actuator systems will be made. 
10. Module 4:Applications Nano-sensors  Nanosensors can be prepared by using different methods. Three common methods are top-down lithography, bottom-up fabrication, and self-assembled nanostructures. The application range of each method will be described. 
11. Nano-optics  nano-optics is the study of light-matter interactions on the nanometre scale. Various applications of nano-optics are envisaged. 
12. Module 5: Nano-measuring systems Mehanical measuring systems  Features of mechanical measuring systems, vertical resolution of profile instrument, and horizontal resolution of profile instrument for nano-systems are described. 
13. Electron beam measuring systems  The principles, resolution and capability of scanning electron microscope and transmission electron microscope are described. 
14. Future trends of nanotechnology  Wearable fitness technology, printed sensors with fine futures, self-healing structures, making big data possible, and tackling climate change are some of the future trends the might be available soon. 
15. Summary of the five modules  A summary of the five modules is presented. 
その他(履修条件・関連科目など)
Adequate and well researched presentations are expected for each class. 
授業形態・方法
Each lesson is based on a well prepared powerpoint presentation, followed by a detailed discussion of the fundamental ideas behind the content of the presentation. 
成績評価方法
Presentation and discussion 40%:理解度,説明手法
Final report 60%:論理の展開方法,関連事項の調査 
成績評価基準
 C(合格)となるためには、到達目標を最低限達成することが必要である。 
テキスト
番号 【書籍名】 【著者】 【出版社】
1. Self-research     
参考資料文献等
番号 【書籍名】 【著者】 【出版社】
1. Self-research     
参考URL
1. Self-research   
画像
ファイル
更新日付 2022/01/31 17:05


PAGE TOP